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  • Tilt Compensation of Wafer Transfer Robot to Prevent Scratches during Wafer Transport

Tilt Compensation of Wafer Transfer Robot to Prevent Scratches during Wafer Transport

Tilt Compensation of Wafer Transfer Robot to Prevent Scratches during Wafer Transport Y. K. JI, S. Islam Md ,S. S. Choi, H. S. Jang ,J. H. Shim, K. H. Kim, H. Y. Kim

Abstract & Research background
Abstract & Research background
Measurement Process
Measurement Process
Analysis of Actual Test Results
Analysis of Actual Test Results
Conclusion

This study proposes a method to optimize robot posture based on the tilt correlation between the wafer transfer robot and FOUP. The goal is to enable real-time FOUP tilt correction via OHT-mounted jigs and to store vibration data for future fault diagnosis and predictive maintenance.